The 81st JSAP Autumn Meeting, 2020/Presentation Search

Think about applied physics in space Critical Role of Semiconductor Technology: Shaping Auto Industry on "New Normal" Infrastructure and Challenges by Cutting-Edge Researchers To accelerate social implementations of applied-physic technlogies related to integrated circuits Recent studies of Boron Neutron Capture Therapy (BNCT) Innovation and development of new business created by photonics III - Photonic startups launched from universities and national institutes- The Third-generation dissimilar materials bonding and its application to the film growth control: Interface nano-kubernetes Extreme environmental nano-interface science connecting materials and devices Innovation with all-solid-state batteries: from basics to future prospects The interplay of ions and electrons in functional oxides towards new development of energy creating and storage devices The fusion of multidimensional measurement technologies and data science toward the progress of bioimaging and biosensing techniques Optical functions of thin films studied by various quantum beams Frontier of Research on Mechanism of Plasma-induced Biological Reactions Novel Function and Technology Based on Ensemble Phenomenon Recent Progress in Nonvolatile Memory technologies - Spintronic, Phase-change, Resistive and Ferroelectric- Advanced measurement technology realized by superconductor -Recent applications of SQUID- Recent progress in Advanced Ion Microscopy: Application to nano materials / devices and life science Materials Science and Advanced Electronics Created by Singularity of Nitride Semiconductors -Frontiers in defect physics: Concerted approach of characterization and theory- Functionality and science of transparent crystals: Ecosystems created by deep ultraviolet emitters Development of the engineering for the diverse stable phases ~Objectives for the future environment, energy materials and devices Science of 2-dimensional materials: New science and applications of 2-dimensional materials and their integrated structures Leading edge of phonon engineering What comes after " Materials Informatics"

FS.1 Focused Session "AI Electronics"

1.1 Interdisciplinary and General Physics 1.2 Education 1.3 Novel technologies and interdisciplinary engineering 1.4 Energy conversion, storage, resources and environment 1.5 Instrumentation, measurement and Metrology 1.6 Ultrasonics

2.1 Radiation physics and Detector fundamentals 2.2 Detection systems 2.3 Application, radiation generators, new technology 2.5 Medical application 2.6 Radiation-induced phosphors

3.1 Basic optics and frontier of optics 3.2 Equipment optics and materials 3.3 Information photonics and image engineering 3.4 Biomedical optics 3.5 Laser system and materials 3.6 Ultrashort-pulse and high-intensity lasers 3.7 Laser processing 3.8 Optical measurement, instrumentation, and sensor 3.9 Terahertz technologies 3.10 Optical quantum physics and technologies 3.11 Photonic structures and phenomena 3.12 Nanoscale optical science and near-field optics 3.13 Semiconductor optical devices 3.14 Optical control devices and optical fibers 3.15 Silicon photonics and integrated photonics

4.1 Plasmonics and Nanophotonics 4.2 Photonics Devices, Photonic Integrated Circuit and Silicon Photonics 4.3 Lasers and laser materials processing 4.6 Terahertz Photonics 4.7 Quantum Optics and Nonlinear Optics 4.8 OSA Special Lecture

6.1 Ferroelectric thin films 6.2 Carbon-based thin films 6.3 Oxide electronics 6.4 Thin films and New materials 6.5 Surface Physics, Vacuum 6.6 Probe Microscopy

7.1 X-ray technologies 7.2 Applications and technologies of electron beams 7.3 Micro/Nano patterning and fabrication

8.1 Plasma production and diagnostics 8.2 Plasma deposition of thin film, plasma etching and surface treatment 8.3 Plasma nanotechnology 8.4 Plasma life sciences 8.5 Plasma phenomena, emerging area of plasmas and their new applications 8.6 Plasma Electronics English Session 8.7 Plasma Electronics Invited Talk 8.8 Plasma Electronics Award Speech

9.1 Dielectrics, ferroelectrics 9.2 Nanoparticles, Nanowires and Nanosheets 9.3 Nanoelectronics 9.4 Thermoelectric conversion

10.1 Emerging materials in spintronics and magnetics (including fabrication and charactrization methodologies) 10.2 Fundamental and exploratory device technologies for spin 10.3 Spin devices, magnetic memories and storages 10.4 Semiconductor spintronics, superconductor, multiferroics 10.5 Application of magnetic field

11.1 Fundamental properties 11.2 Thin and thick superconducting films, coated conductors and film crystal growth 11.3 Critical Current, Superconducting Power Applications 11.4 Analog applications and their related technologies 11.5 Junction and circuit fabrication process, digital applications

12.1 Fabrications and Structure Controls 12.2 Characterization and Materials Physics 12.3 Functional Materials and Novel Devices 12.4 Organic light-emitting devices and organic transistors 12.5 Organic solar cells 12.6 Nanobiotechnology 12.7 Biomedical Engineering and Biochips

13.1 Fundamental properties, surface and interface, and simulations of Si related materials 13.2 Exploratory Materials, Physical Properties, Devices 13.3 Insulator technology 13.4 Si processing /Si based thin film / MEMS / Equipment technology 13.5 Semiconductor devices/ Interconnect/ Integration technologies 13.6 Nanostructures, quantum phenomena, and nano quantum devices 13.7 Compound and power electron devices and process technology 13.8 Optical properties and light-emitting devices 13.9 Compound solar cells

15.1 Bulk crystal growth 15.2 II-VI and related compounds 15.3 III-V-group epitaxial crystals, Fundamentals of epitaxy 15.4 III-V-group nitride crystals 15.5 Group IV crystals and alloys 15.6 Group IV Compound Semiconductors (SiC) 15.7 Crystal characterization, impurities and crystal defects

16.1 Fundamental properties, evaluation, process and devices in disordered materials 16.2 Energy Harvesting 16.3 Bulk, thin-film and other silicon-based solar cells

17.1 Carbon nanotubes & other nanocarbon materials 17.2 Graphene 17.3 Layered materials

21.1 Joint Session K "Wide bandgap oxide semiconductor materials and devices"

22.1 Joint Session M "Phonon Engineering"

23.1 Joint Session N "Informatics"

【CS.1】 Code-sharing Session of 2.4 & 7.5 【CS.2】 Code-sharing Session of 3.2 & 12.3 【CS.3】 Code-sharing Session of 3.3 & 4.4 【CS.4】 Code-sharing Session of 4.5 & 17 【CS.5】 Code-sharing Session of 6.1 & 13.3 & 13.5 【CS.6】 Code-sharing Session of 6.5 & 7.6 【CS.7】 Code-sharing Session of 7.4 & 9.5 【CS.8】 Code-sharing Session of 8.3 & 9.2 & 13.6

⾼温超伝導コイル：基礎技術と医療分野への応⽤を中⼼にグラフェンと2次元物質の基礎と2020年代の重点課題プログラムコードを触って学ぶ機械学習

代議員会議第20回応用物理学会業績賞授賞式、フェロー表彰式、論文賞授賞式、功労会員証贈呈式

Exhibitor

Bruker Japan K.K. シュプリンガー・ネイチャーエクセルソフト（株）（株）東陽テクニカ　カールツァイス(株)　富士通(株)/ (株)富士通九州システムズ　

Networking Lounge(Remo)

Presentation Search

▲ [10p-Z06-17] Fabrication of a NV center diamond probe by using focused ion beam for scanning magnetic field imaging

[10p-Z06-1~19] 6.6 Probe Microscopy

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