The 81st JSAP Autumn Meeting, 2020

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[10p-Z04-1~17] 13.7 Compound and power electron devices and process technology

Thu. Sep 10, 2020 1:00 PM - 5:30 PM Z04

Taketomo Sato(Hokkaido Univ.), Toshiharu Kubo(Nagoya Inst. of Tech.)

1:45 PM - 2:00 PM

[10p-Z04-4] Buffer Layer Structure Dependence of Electrical Characteristics of AlGaN/GaN HEMTs Fabricated on GaN substrates

Hidemasa Takahashi1, Yuji Ando1, Jun Suda1,2 (1.Nagoya Univ., 2.Nagoya Univ. IMaSS)

Keywords:semiconductor, GaN, HEMT

To maximize the potential of next-generation semiconductor GaN, we are developing GaN-HEMTs on GaN substrates. In this study, we investigated the effect of buffer layer structure on drain breakdown voltage and current collapse by using HEMT epi grown on GaN substrate with different structure of buffer layer. Both device with C-doped and Fe-doped buffers showed good characteristics