The 81st JSAP Autumn Meeting, 2020

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[11p-Z04-1~14] 13.7 Compound and power electron devices and process technology

Fri. Sep 11, 2020 1:00 PM - 4:45 PM Z04

Masashi Kato(Nagoya Inst. of Tech.)

1:30 PM - 1:45 PM

[11p-Z04-3] Reduction of Leakage Current Through Interface Between Ga2O3 Epitaxial Layer and Substrate by Mg/ Fe Implantation

Sandeep Kumar1, Takafumi Kamimura1, Chia-Hung Lin1, Yoshiaki Nakata1, Masataka Higashiwaki1 (1.NICT)

Keywords:Ga2O3, Mg/Fe Implantation, Leakage Current

Ga2O3 field effect transistors have shown tremendous potential for their possible applications in the field of power and RF electronics . Recently, a technical problem with Ga2O3 epitaxial structures that unwanted Si impurit ies accumulate at an interface between the epitaxial layer and the substrate is often discussed . This phenomenon results in formation of undesirable leakage current path in a buffer layer of the Ga2O3 FET , leading to poor turn off and breakdown characteristics In this work , we attempted to address the interface leakage issue by means of Mg or Fe ion implantation doping in to Ga2O3 native substrates for compensation of t he unintentionally doped (UID) Si donors prior to the subsequent epitaxial growth and succeeded in significantly reducing the interface leakage current by the Fe implantation.