The 81st JSAP Autumn Meeting, 2020

Presentation information

Oral presentation

7 Beam Technology and Nanofabrication » 7.3 Micro/Nano patterning and fabrication

[9p-Z25-1~6] 7.3 Micro/Nano patterning and fabrication

Wed. Sep 9, 2020 1:00 PM - 2:30 PM Z25

Jiro Yamamoto(Hitachi), Jun Taniguchi(Tokyo Univ. of Sci.)

1:45 PM - 2:00 PM

[9p-Z25-4] Fabrication of flexible two-stage through electrode using transfer method

Atsuhiro Furuta1, Jun Taniguchi1 (1.Tokyo Univ. of sci)

Keywords:nanoimprint, interposer

A silicon through electrode using silicon is mainly used as a through electrode, which is a connection method excellent in terms of device miniaturization and high density. In this study, a flexible through electrode was made in two stages.