11:00 AM - 11:15 AM
[12a-A202-5] Potential evaluation of grinding surface of Si wafers using a Laser Terahertz Emission Microscope
Keywords:Grinding surface, Terahertz wave, Femtosecond laser
A Laser Terahertz Emission Microscope (LTEM) is a technique for visualizing THz waves emitted by irradiating a sample such as a semiconductor with femtosecond laser pulses. Since THz waves are emitted from the semiconductor interface region (including the surface), the characteristics of the region can be selectively analyzed by a non-contact method. In recent years, the importance of a wafer surface grinding technique and its evaluation technique has been increasing. We report the non-destructive and non-contact measurement of the surface potential of the grinding Si wafer surface using LTEM.