[12p-B508-1~12] 3.5 レーザー装置・材料

▲ [12p-B508-5] 19-crystal chip made by room temperature surface activated bonding for
laser amplifier system

〇(D)Arvydas Kausas¹、Rui Zhang²、Xiangyu Zhou²、Yousuke Honda²、Mitsuhiro Yoshida²、Takunori Taira³ (1.IMS、2.KEK、3.RIKEN)

キーワード：amplifier, Surface activated bonding, Nd:YAG ceramic

In this work we manufactured 19-crystal chip by room temperature surface activated bonding. In a periodic manner sapphire and ceramic Nd:YAG crystals were combined into 25 mm thick sructure which was used for the amplifier system. By use of 8.85 kW pump with 250 us pump pulse duration the >2 J pump @ 885 nm was introduced into bonded structure in a single pass amplification scheme. Due to a low absorption of the pump wavelength and aperture effect of the ceramic Nd:YAG crystal, less than 1 J of pump power was absorbed. With this setup we received 300 mJ output from the amplifier. In future work bonded chip and pumping setup will be optimised for 1 J output.