[14a-PA2-1~18] 9.2 Nanoparticles, Nanowires and Nanosheets

[14a-PA2-5] Effects of Particle Sizes and Cu-paste Solvents for Fabrication of Conductive Cu Films

〇(M1)Tatsuya Ito¹, Manabu Ishizaki¹, Masato Kurihara¹ (1.Yamagata Univ.)

Keywords:nanoparticles

Due to the miniaturization of electronic devices, attention has been paid to a material fixing method using printed electronics (PE). As a material that can be adapted to this, copper nanoparticles are important materials because of their low resistance, low cost, and electromigration resistance, but copper nanoparticles are easily oxidized and have a property of causing an increase in resistance. In this study, we investigated the possibility of suppressing oxidation during heat sintering by synthesizing copper sub-microparticles with oxidation resistance and examining the dispersion medium when preparing paste.