The 67th JSAP Spring Meeting 2020

Presentation information

Poster presentation

12 Organic Molecules and Bioelectronics » 12.2 Characterization and Materials Physics

[14a-PB6-1~17] 12.2 Characterization and Materials Physics

Sat. Mar 14, 2020 9:30 AM - 11:30 AM PB6 (PB)

9:30 AM - 11:30 AM

[14a-PB6-17] Improvement of cyclic bending durability of printed Ag wirings using different-shaped Ag fillers

Kazuki Maeda1, Yukiyasu Kashiwagi1, Masashi Nitani1, Mayumi Uno1 (1.ORIST)

Keywords:flexible device, printed electronics, cyclic bending durability

Flexible wirings fabricated on plastic films play a significant role in bendable and foldable devices. In these applications, excellent bending reliability is required for flexible wirings. We have examined bending reliability of printed silver wirings with different kinds of filler shapes in pastes: One paste includes spherical fillers (paste A) and another includes flake-shape fillers (paste B). These pastes were printed on polyethylene naphthalate films by screen printing and their bending durability was examined by cyclic bending tests. In the result, the flake-shape one exhibited much higher durability than the one with spherical fillers. Furthermore, mixing 30 % paste B to paste A improved the bending durability greatly. We consider the difference of the bending durability is attributed to the adhesiveness of fillers each other and fillers-to-substrates.