[14p-A201-1~8] Nano-cybernetics of interface bonded at room or low temperature and ultra thin films at heterojunction interface

[14p-A201-1] Are Oxide Films Good or Evil on Room Temperature Joining by Surface Activated Bonding Technique ?

〇Kazuhiro Ogawa¹, Yudai Terui¹, Kohei Watanabe¹, Yuji Ichikawa¹ (1.Tohoku Univ.)

Keywords:Surface Activated Bonding, Toom Temperature Joining, Oxide Film

Surface activation bonding (SAB) technique, which is one of room temperature joining techniques, is to remove surface oxide on the metal surfaces and make them expose activated faces, and then bond together without temperature rise. Previously, we have tried to bonded between steels and aluminum by SAB. However, good bonding between steels and aluminum was not obtained, because aluminum as an active metal can re-oxidize. In this study, it was considered whether to remove surface oxide or not on metal surfaces for obtaining good bonding by SAB technique.