The 67th JSAP Spring Meeting 2020

Presentation information

Oral presentation

3 Optics and Photonics » 3.15 Silicon photonics and integrated photonics

[14p-B508-1~8] 3.15 Silicon photonics and integrated photonics

Sat. Mar 14, 2020 3:45 PM - 6:00 PM B508 (2-508)

Taro Arakawa(Yokohama Natl. Univ.), Tomohiro Kita(Waseda Univ.)

4:00 PM - 4:15 PM

[14p-B508-2] Design of densely-packed VCSEL array for parallel data transmission with multi-core fiber

〇(M1)Mikito Yoshiki1 (1.Toukou Univ.)

Keywords:Vertical Cavity Surface Emitting LASER, Multi-core fiber

Due to the explosion of IoT devices and autonomous driving that require quick response, the data transfer volume within and between devices in data centers is currently increasing explosively. To cope with this, standardization of higher-speed 400GbE and development of equipment and optical transmission / reception modules compatible with the standardization are being advanced. In this study, we develop a 16Gbps VCSEL module with 25Gbps per channel, which is the most suitable for multi-core fiber, in order to develop a next generation ultra-small optical transceiver capable of large capacity transmission and compact mounting of 400Gbps class.