[14p-PB7-1~29] 12.3 Functional Materials and Novel Devices

△ [14p-PB7-4] The suppression of bending surface strain in a polymer substrate for flexible electronics

〇Ryo Taguchi¹, Kohei Kuwahara¹, Norihisa Akamatsu¹, Atsushi Shishido¹ (1.Lab. for Chem. & Life Sci., Tokyo Tech.)

Keywords:Polymer Film, Bending Surface Strain, Flexible electronics

Flexible devices are fabricated by depositing conductive and semi-conductive components on flexible polymer substrates, which draws considerable attention. However, conventional components are hard and brittle, and thus are inevitably damaged by large surface strain in the bending substrates. In this study, we developed a method to quantitatively measure the bending surface strain for various polymer films and subsequently designed a polymer substrate exhibiting small surface strain.