The 67th JSAP Spring Meeting 2020

Presentation information

Oral presentation

3 Optics and Photonics » 3.15 Silicon photonics and integrated photonics

[15a-B508-1~8] 3.15 Silicon photonics and integrated photonics

Sun. Mar 15, 2020 9:30 AM - 11:45 AM B508 (2-508)

Shota Kita(NTT), Hiromasa Shimizu(TUAT)

10:45 AM - 11:00 AM

[15a-B508-5] Dependence of Si waveguide width on properties of RWG-lasers with III-V/Si direct bonding structure

Takehiko Kikuchi1,2, Naoki Fujiwara1, Takuo Hiratani1, Toshiyuki Nitta1, Moataz Eissa2, Yuning Wang2, Yutaka Makihara2, Nobuhiko Nishiyama2,3, Hideki Yagi1 (1.TDL, Sumitomo Electric., 2.Tokyo Tech., 3.IIR, Tokyo Tech.)

Keywords:III-V/Si hybrid integration, Direct bonding, Ridge-waveguide laser

The III-V/Si hybrid integration technologies is very attractive for the realization of a new-generation photonic integrated circuit. In particular, it is possible for the hybrid laser with III-V/Si direct bonding structure to control the distribution of optical field in the gain region depending on the application, designing the width of the III-V region and the Si waveguide individually. In this presentation, we report the Si waveguide width dependence of the properties of III-V/Si ridge-waveguide laser, and experimentally demonstrate the controllability of effective gain and lateral mode for the hybrid structure.