2020年第67回応用物理学会春季学術講演会

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13 半導体 » 13.4 Si系プロセス・Si系薄膜・MEMS・装置技術

[15a-PB3-1~12] 13.4 Si系プロセス・Si系薄膜・MEMS・装置技術

2020年3月15日(日) 09:30 〜 11:30 PB3 (第1体育館)

09:30 〜 11:30

[15a-PB3-4] Electrodeposited High Strength Au-TiO2 Nano Composite Film for MEMS Devices

〇(M2)Yuan Chien1、Tso-Fu Mark Chang1、Chun-Yi Chen1、Daisuke Yamane1、Hiroyuki Ito1、Katsuyuki Machida1、Kazuya Masu1、Masato Sone1 (1.Tokyo Tech)

キーワード:Metal matrix composites, electrodeposition, Au-TiO2

In this study, high strength Au-based composited films was achieved through TiO2 nanoparticles (NPs) reinforcement. The Au-TiO2 composite film was electrodeposited onto a copper plate with a 1 cm2 surface area using galvanostatic method. Different surface morphologies of composite films with different TiO2 contents were observed through scanning electron microscope (SE4300, Hitachi). The surfaces were found to be composed of particles, and a decrease in the particle size was observed with an increase in amounts of TiO2 in the film from 0 to 2.72 wt%. Broadened XRD peaks of the Au-TiO2 composite film containing 2.72 wt% TiO2 indicated grain refinement caused by co-deposition with the NPs. The primary characteristic peak of TiO2 at 2θ = 25.1° also appeared in the XRD patterns of the Au-TiO2 composite film containing 2.72 wt% TiO2 NPs. The scanning ion microscope (SIM, FB-2100, Hitachi) images and a stress-strain curve of a micro-pillar fabricated from the composite film containing 2.72 wt% TiO2 NPs showed that yield strength of the pillar was 0.84 GPa, which was much higher than that of pure gold electroplated through conventional method.