The 67th JSAP Spring Meeting 2020

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[15a-PB3-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Sun. Mar 15, 2020 9:30 AM - 11:30 AM PB3 (PB)

9:30 AM - 11:30 AM

[15a-PB3-5] Electroplating of Au-Pd Alloy Films and the Mechanical Properties

〇(M2)Tomoki Iriya1, kyotaro Nitta1, Chun-Yi Chen1, Tso-Fu Mark Chang1, Daisuke Yamane1, Hiroyuki Ito1, Katsuyuki Machida1, Kazuya Masu1, Masato Sone1 (1.Tokyo Tech)

Keywords:Au-Pd alloys, electroplating, Vickers hardness

MEMS加速度センサーの錘としての応用が期待される金材料の機械的性質を調べるため、Au/Pd合金を5mA/cm2~11mA/cm2の電流密度で電気めっきさせ、そのビッカース硬さを測定した。