[10a-N405-1~9] CS.6 3.13 半導体光デバイス、4.2 Photonics Devices, Photonic Integrated Circuit and Silicon Photonicsのコードシェアセッション

▲ [10a-N405-3] Infrared absorbing material for Indoor Heat Dissipation

〇(M2)WenHao Li¹、YuChi Ma¹、JiaHan Li¹ (1.Department of Engineering Science Ocean Engineering, National Taiwan University, Taipei 106 17, Taiwan)

キーワード：radiative cooling, heat dissipation, cooling paint

The radiative cooling materials are often chosen to have high infrared light absorption. A radiative cooler is designed to move the heat from the inner space with infrared absorbing material. The inner surface of the cooler material can absorb the thermal heat while the outside of the cooler mateiral can emit the infrared light to the air. In this work, an infrared absorbing cooler was made by cooling paint and copper. The cooler studied in this research is using the heat conduction between the copper and outside air. According to this work, the concept of infrared absorption material to increase the heat dissipation can work. In future work, this concept can be used for the cooling case of computers and mobile phones. According to the performance of our design, which combines radiative cooling material and enclosure, it may be able to use as the cooling enclosure to cool down the electronic device heat.