The 82nd JSAP Autumn Meeting 2021

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Oral presentation

12 Organic Molecules and Bioelectronics » 12.7 Biomedical Engineering and Biochips

[10p-S402-1~18] 12.7 Biomedical Engineering and Biochips

Fri. Sep 10, 2021 1:30 PM - 6:30 PM S402 (Oral)

Shigeyasu Uno(Ritsumeikan Univ.), Hiroaki Takehara(Univ. of Tokyo), Takeshi Kawano(Toyohashi Univ. of Tech.)

2:30 PM - 2:45 PM

△ [10p-S402-5] Flexible Fine Interconnect Formation for In-Mold Electronics with Embedded Chiplets

〇Tomo Odashima1, Yuki Susumago1, Zhe Wang1, Hisashi Kino3, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1.Engineering, Tohoku Univ., 2.Biomedical Engineering, Tohoku Univ., 3.FRIS, Tohoku Univ.)

Keywords:flexible hybrid electronics