2:55 PM - 3:25 PM
[11p-S101-4] Quantum Computer with Integration Technology of Diamond Devices
Keywords:quantum computer, semiconductor process, diamond
Electron spins in a color-center of diamond can provides highly stable fluorescence at a relatively high cryogenic temperature and entanglement between spins via photons. Another advantage is that the presence of nearby nuclear spins can be coherently coupled to the electronic spin with a long coherent time. The modules of electron and nuclear spins can be entangled with an optimum distance between them hence minimizing the cross-talk and error-rate.
Here, on-chip integration of the diamond devices with routing, control and readout circuits will provide, in combination with the higher operating temperature, a small form factor system with a faster operation and a high reliability. There exit, however, several engineering challenges in order to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. 3D stacking of an array of diamond devices, electronic and photonic integrated circuits will be a scalable solution, however it requires a lot of expertise in the area of material, electronics, photonics, and semiconductor front/back-end process including packaging. I will address those challenges and discuss future outlook of the process and integration technology of diamond devices and cryogenic electronic and photonic circuits for realization of a scalable quantum computer.
Here, on-chip integration of the diamond devices with routing, control and readout circuits will provide, in combination with the higher operating temperature, a small form factor system with a faster operation and a high reliability. There exit, however, several engineering challenges in order to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. 3D stacking of an array of diamond devices, electronic and photonic integrated circuits will be a scalable solution, however it requires a lot of expertise in the area of material, electronics, photonics, and semiconductor front/back-end process including packaging. I will address those challenges and discuss future outlook of the process and integration technology of diamond devices and cryogenic electronic and photonic circuits for realization of a scalable quantum computer.