[12a-N106-1~9] 22.1 Joint Session M "Phonon Engineering"

△ [12a-N106-2] Exploring the interfacial phonon transport by self-assembled monolayer
functionalization

〇BIN XU¹, Shiqian Hu¹, Shih-wei Hung¹, Junichiro Shiomi¹ (1.Univ. Tokyo)

Keywords:thermal boundary conductance, self-assembled monolayer

The rapid advances in electronics have triggered increasing demand for effective heat dissipation at the material level, for which interfaces between constituent materials or inside composites are critical since they are significant scatterers for phonons, resulting in thermal resistance. Herein, we study the thermal transport at systems with various mismatched vibrational frequencies modified by a self-assembled monolayer (SAM). An anomalous dependence of TBC in the interfacial adhesion is found, where lower interfacial adhesion can provide higher thermal boundary conductance at a highly mismatched copper/diamond interface. through systematic study both experimentally and theoretically, we discover a competitive correlation between interfacial adhesion and phonon mismatch bridging in determining the thermal boundary conductance when modified the interfacial structure, which provides novel insight into the interfacial thermal transport manipulation.