The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[12a-N305-1~10] 13.7 Compound and power devices, process technology and characterization

Sun. Sep 12, 2021 9:00 AM - 11:45 AM N305 (Oral)

Takahiro Makino(QST)

9:45 AM - 10:00 AM

[12a-N305-4] Transient internal temperature measurement of SiC-Schottky Barrier Diode using Optical-Interference Contactless Thermometry (OICT)

Keiya Fujimoto1, Hiroaki Hanafusa1, Takuma Sato1, Seiichiro Higashi1 (1.Hiroshima Univ.)

Keywords:SiC, OICT

As the device becomes smaller and has higher performance, the temperature rise due to self-heating becomes more serious, leading to deterioration of performance and life. However, the conventional measurement method is to measure the transient temperature change inside the device. We have been developing an Optical-Interference Contactless Thermometry (OICT) that utilizes the interference of light transmitted through the inside of the wafer. In this study, we applied it to visualize the internal thermal diffusion process during operation of the SiC-Schottky Barrier Diode (SBD).