The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[12a-N323-1~8] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Sun. Sep 12, 2021 9:45 AM - 12:00 PM N323 (Oral)

Daisuke Yamane(Ritsumeikan Univ.), Shiro Hara(National Institute of Advanced Industrial Science and Technology)

10:30 AM - 10:45 AM

[12a-N323-4] Anticorrosive behavior of SiCxNyOz thin film produced by room temperature PECVD

Kenta Hori1, 〇Hiroki Kawakami1, Hitoshi Habuka1 (1.Yokohama Nat.Univ.)

Keywords:plasma CVD, SiCNO

Since the SiCxNyOz thin film exhibits chemical resistance due to SiOx, SiC, and SiNx, it is expected that it can be applied as a protective film. So far, when an amorphous SiCxNyOz film is formed using nitrogen (N2) and monomethylsilane (SiH3CH3, MMS) in room temperature Ar plasma, the composition can be quantitatively predicted by the partial pressure and current value of the raw material gas. , Increased nitrogen concentration
It has been reported that the corrosion resistance is reduced by [1-3].
In this study, we observed the corrosion resistance obtained when exposed to chlorine trifluoride (ClF3) gas, and discussed the relationship between its behavior and composition, and report the details.