The 82nd JSAP Autumn Meeting 2021

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Oral presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[12p-N304-1~14] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Sun. Sep 12, 2021 1:30 PM - 5:15 PM N304 (Oral)

Yusuke Higashi(Kioxia), Junichi Koike(東北大)

4:45 PM - 5:00 PM

[12p-N304-13] Bromine concentration dependence of neutral electroless copper plating rate

〇Tomoya Sawafuji1, Osamu Sugiura1 (1.Chiba Inst. of Tech.)

Keywords:neutral electroless copper plating, copper wiring