[13p-N207-1~8] 12.3 Functional Materials and Novel Devices

△ [13p-N207-8] Development of the technique for mechanical interlocking between gel/elastomer for hydrogel electronics

〇Ryota Suwabe¹, Hayato Yoroizuka¹, Yuka Ogihara¹, Yuina Abe¹, Hiroya Abe^1,2, Matsuhiko Nishizawa¹ (1.Tohoku Univ., 2.FRIS, Tohoku Univ.)

Keywords:hydrogel, elastomer, bonding

Recently, the adaptation of hydrogels to electronics, such as wearable devices, has attracted much attention. Elastomers are often incorporated into hydrogel-based devices, hence their bonding is important. Various chemical bonding techniques have been reported, but these do not work for some combinations of hydrogel and elastomer and may be toxic. We have developed a bridge structure that mechanically joins hydrogels and elastomers, which is necessary for hydrogel-based electronics. The bridge structure consists of a thin film on top of a number of cylinders, and the gel flows and becomes locked in the space between the cylinders and the thin film. Two kinds of peel tests were conducted on the specimens with the bridge structure, and it was confirmed that the bonding strength of the specimens with the bridge structure was higher than that of the specimens without the bridge structure in both tests.