TOSHIHIRO KUGE

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Speaker, Author, Co-Author

Wed. Mar 17, 2021 1:30 PM - 6:00 PM Z26 (Z26)

Oral presentation
| 13 Semiconductors
| 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[17p-Z26-1~15] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

5:15 PM - 5:30 PM

[17p-Z26-13] Physical Properties of Next Generation Interconnect Material CuAl₂

〇TOSHIHIRO KUGE^1,2, LINGHAN CHEN¹, MASATAKA YAHAGI^1,2, JUNICHI KOIKE¹ (1.Tohoku Univ., 2.JX Nippon Mining & Metals Corp.)