The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.2 Exploratory Materials, Physical Properties, Devices

[16a-Z23-1~11] 13.2 Exploratory Materials, Physical Properties, Devices

Tue. Mar 16, 2021 9:00 AM - 12:00 PM Z23 (Z23)

Haruhiko Udono(Ibaraki Univ.), Kenji Yamaguchi(QST)

11:45 AM - 12:00 PM

[16a-Z23-11] Bulk moduli and bulk thermal expansion coefficients of silicides

Motoharu Imai1, Takanobu Hiroto1 (1.NIMS)

Keywords:silicides, thermal expansion coefficient, bulk modulus

本研究では、CoSi2の熱膨張係数を再評価し、シリサイドの体積弾性率と熱膨張係数の関係を調べた。