Power Semiconductor Devices, Power Systems and Electronics Packaging Techniques and Technical Trend for Next Generation Automotive and Air-Flying Automobiles

Masayoshi Yamamoto

Presentation information

Symposium (Oral)

Symposium » [Open Symposium] Technological Evolution of Advanced Mobility and Power Electronics

[17p-Z04-1~9] [Open Symposium] Technological Evolution of Advanced Mobility and Power Electronics

Wed. Mar 17, 2021 1:30 PM - 6:10 PM Z04 (Z04)

Satoshi Tanimoto(FUKUSHIMA SiC Applied Engineering Inc.), Seiji Suzuki(Panasonic), Yamada Yasushi(Daido Univ.)

4:05 PM - 4:35 PM

[17p-Z04-5] Power Semiconductor Devices, Power Systems and Electronics Packaging Techniques and Technical Trend for Next Generation Automotive and Air-Flying Automobiles

〇Masayoshi Yamamoto¹ (1.Nagoya Univ.)

Keywords:Electric Vehicle, Power Electronics, Power Electronics Packaging

In case of the next generation automotive and the air-flying automotive applications, the power electronics system will require higher power density and higher efficiency performance. In this presentation, each requirement will be discussed from power semiconductor device area, power electronics system area and electronics packaging area point of views using the example of MODEL 3 (TESLA).