[17p-Z04-1~9] [Open Symposium] Technological Evolution of Advanced Mobility and Power Electronics

[17p-Z04-7] Packaging Materials Project for High Tj Operation Power Module (KAMOME & KAMOME A)

〇Akio Takahashi¹ (1.YNU)

Keywords:power device, power module, packaging material

SiC power semiconductor devices to control motor of xEV have gained attention due to their wide bandgap and ability to operate at a low loss and high efficiency at temperature above 200℃. New packaging technologies such as bonding technologies, molding materials and thermal conductive adhesions for the power device module are required to withstand these high temperatures. The KAMOME project aimed to support material development and the evaluation, was established in 2011 in response to the ongoing technological trends involving SiC power devices. This report presents an overview of the 9 year KAMOME project.