[18a-Z18-1~11] 3.16 Optics and Photonics English Session

▲ [18a-Z18-4] Ligand Engineering and Self-Assemble Recrystallization of Perovskite Nanocrystals for High-Quality Patterning and Single-Mode Lasing

〇(D)Xing Di¹, Cheng-Chieh Lin², Ya-Lun Ho¹, A. Syazwan A. Kamal¹, I-Ta Wang², Chia-Chun Chen², Cheng-Yen Wen², Chun-Wei Chen², Jean-Jacques Delaunay¹ (1.The Univ. of Tokyo, 2.National Taiwan Univ.)

Keywords:Perovskite, Lithography, Single-mode laser array

Lead halide perovskites exhibiting extraordinary performances in optoelectronics are promising media for the next-generation photonic devices. The practical application of photonic devices requires that they can be integrated on chip in arbitrary shape and position. However, a significant bottleneck in perovskite lasers is their chemical reactivity, which leads to instability issues and currently prevents manufacturing by well-established semiconductor top-down lithography process resulting in high-roughness, low-defect, and high-quality perovskite devices. Here, a top-down and etching-free fabrication technique assisted by ligand engineering and self-assemble recrystallization of CsPbBr₃ nanocrystals is demonstrated for large-area patterning and single-mode laser arrays. The ligand engineering and self-assemble recrystallization process greatly improve the lasing property (single mode lasing with a high quality-factor ~ 1700 and a low threshold ~ 3.8 μJ/cm²) of the laser arrays. With the precise control of the high-quality laser cavity scale, a modulation of wavelengths is realized up to ≈ 8 nm. These results report a strategy for top-down fabricated high-quality perovskite devices on-chip and enable research on the development of large-area and low scattering loss perovskite integrated optical circuits.