Exhibitors' information
[P-13] MARUBUN CORPORATION
Wafer surface defect inspection equipment, Wafer thickness / warpage measurement sensor, High-accuracy Flip-chip bonders etc
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Address
103-8577
東京都中央区日本橋大伝馬町8-1 -
Tel
03-3639-9823
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Fax
03-3639-2358
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Web site, SNS