[20p-C105-1~15] 12.3 Functional Materials and Novel Devices

△ [20p-C105-4] Flexible Wiring Method for the Integrated Flexible Electronics System

〇Masahito Takakuwa^1,2, Daishi Inoue², Kenjiro Fukuda², Tomoyuki Yokota³, Shinjiro Umezu¹, Takao Someya^2,3 (1.Waseda Univ., 2.RIKEN, 3.University of Tokyo)

Keywords:Bonding, Flexible Electronics, Wiring

Direct bonding of parylene polymers, which are the substrates of flexible electronics, is required to bond separately manufactured flexible electronics to each other and to form a system. However, the previous parylene direct bonding method, the heat press method (over 160 degrees) causes degradation of the organic electronics because the general heat resistant temperature of organic materials is 100 degrees. This research achieved parylene direct low-temperature bonding by plasma and 70 degrees of steam treatment due to the water plasticizer effect.