[20p-C105-1~15] 12.3 Functional Materials and Novel Devices

△ [20p-C105-7] Analysis of Surface Bending Strain in Triple-Layer Polymer Film

〇Takuya Yamoto¹, Kishino Masayuki¹, Taguchi Ryo¹, Aizawa Miho^1,2, Hisano Kyohei¹, Shishido Atsushi¹ (1.Lab. for Chem. & Life Sci., Tokyo Tech, 2.PRESTO, JST)

Keywords:Strain, Bending, Triple-layer film

In flexible devices, bending causes surface strain-induced fracture and deteriorate their device performance. To prevent the fracture, a triple-layer film, in which a soft layer is introduced between two hard layers, has attracted much attention. Under the film bending, shear deformation of the soft layer enables to suppress the surface bending strain. Thus, the triple-layer film has a great potential to be used as a substrate for flexible devices. The shear deformation depends on the mechanical properties of soft and hard layers. In this study, we designed a triple-layer film consisting of hard and soft layers with various elastic moduli, and evaluated the strain suppression ability.