[22a-C105-1~10] 12.3 Functional Materials and Novel Devices

[22a-C105-4] Direct silver bonding method on ultra-thin polymer film

〇(M1)Tatsuma Miyake^1,2, Masahito Takakuwa^1,2, Kenjiro Fukuda², Shinjiro Umezu¹, Takao Someya^2,3 (1.Waseda Univ., 2.RIKEN, 3.Univ. of Tokyo)

Keywords:flexible conductive bonding, silver, flexible electronics

Flexible electronic devices integrated on a few µm thick polymer thin film are expected to enhance the next-generation wearable electronics. Conventional conductive technology has been faced with the problem of maintaining the flexibility of the junction since they require a thick conductive adhesive layer. Here We succeeded in direct conductive bonding of silver electrodes on thin films in air using surface-activated bonding (SAB) with water-vapor plasma. This technology does not lose the flexibility of the bonding area. In the future, this technology is expected to be applied to wiring technology for the next generation of wearable electronics.