[22a-C201-1~10] 3.8 Terahertz technologies (formerly 3.9)

[22a-C201-6] Investigation of Cu-coating by supercritical fluid deposition on high-aspect-ratio features for THz wave devices

Huang Yuyuan¹, Kuniaki Konishi², Momoko Deura¹, Yusuke Shimoyama¹, Junji Yumoto², Makoto Kuwata-Gonokami², Yukihiro Shimogaki¹, 〇Takeshi Momose¹ (1.UTokyo. Sch. of Eng., 2.UTokyo. Sch. of Sci.)

Keywords:Supercritical fluid deposition, Metal coating, Terahertz wave devices

Terahertz wave devices are essential components for controlling THz waves. Due to difficulty in fabrication of metallic THz waves devices, metal-coated devices are concentrated. Recently, 3D printing of dielectrics (i.e. polymer) becomes a potential solution due to its improved resolution. Thus, the combination of 3D printing of polymer substrate and metal film coating attracts attention. We previously developed the model for estimating required film thickness and suitable metal, clarifying Cu is suitable and its necessary thickness ranges 100-300 nm depending on its film quality. Meanwhile, the suitable coating method is under development, and we proposed the supercritical fluid deposition (SCFD) due to its high conformality to high aspect ratio (AR) structures and capability to form highly pure films. SCFD involves chemical reaction of the metal organic precursors to form films in supercritical fluid. In this study, we evaluated the applicability of Cu-SCFD to sub-millimeter-scale THz wave devices.