[22a-E304-1~6] Imaging by using from visible light to X-rays - Exploring its versatility-

[22a-E304-5] Imaging and analysis of thin film layers using diagonal cutting with SAICAS

〇Ryo Sato¹ (1.NIPPON STEEL TECHNOLOGY)

Keywords:Surface And Interfacial Cutting Analysis System, Surface analysis, Battery material analysis

表面界面切削解析装置（SAICAS）による低角度斜め切削面の各種表面分析装置によるイメージング技術をご紹介します。