[23a-E206-1~10] 12.4 Organic light-emitting devices and organic transistors

△ [23a-E206-7] Adhesion evaluation between an ultrathin substrate and supporting substrate
for transfer integration of ultrathin devices

〇(M2)Sumi Yutaro¹, Okutani Chihiro¹, Yokota Tomoyuki¹, Someya Takao¹ (1.Univ. of Tokyo)

Keywords:Organic electronics, Parylene, Adhesion

Ultrathin flexible devices can be directly attached to a curved surface and are fabricated by peeling off ultrathin substrates from supporting substrates. Here, we evaluated adhesion of parylene ultrathin substrates to supporting substrates for easy delamination and strong support. Furthermore, conformable transfer of ultrathin substrate to curved surfaces such as the skin, glass and plastic was demonstrated using adhesive layers.