The 69th JSAP Spring Meeting 2022

Presentation information

Oral presentation

1 Interdisciplinary Physics and Related Areas of Science and Technology » 1.6 Ultrasonics

[23p-D113-1~19] 1.6 Ultrasonics

Wed. Mar 23, 2022 1:00 PM - 6:15 PM D113 (D113)

Yuji Ohashi(Tohoku Univ.), Jun Kondoh(Shizuoka Univ.)

6:00 PM - 6:15 PM

[23p-D113-19] Numerical simulation of Rayleigh-mode SAW propagating in c-axis zigzag ScAlN film/silicon substrate layered structure

〇Takumi Tominaga1, Shinji Takayanagi1, Takahiko Yanagitani2 (1.Doshisha Univ., 2.Waseda Univ.)

Keywords:SAW, ScAlN films, Silicon

SAW devices with a high frequency, high electromechanical coupling factor K2, and high Q factor are required for filters and duplexers in smartphones for next-generation mobile networks. ScAlN films are important candidates for piezoelectric layers due to their high piezoelectricity. We have reported that the K2 value of SAW propagating in the ScAlN film/silicon substrate structure increases due to the ScAlN film c-axis tilt. In this study, we performed a numerical simulation of SAW propagating in the c-axis zigzag ScAlN film/silicon substrate structure to further increase the K2 values of SAW devices. As a result of SAW analysis, the maximum K2 value of Rayleigh-mode SAW was 9.56%. This value is approximately 2.4 times the maximum K2 of the c-axis tilted ScAlN film/silicon substrate structure. These results indicate that the c-axis zigzag ScAlN film/silicon substrate structure is suitable for Rayleigh-mode SAW devices with high electromechanical coupling factor.