The 69th JSAP Spring Meeting 2022

Presentation information

Symposium (Oral)

Symposium » Research trend of laser processing technology incorporated with artificial intelligence

[23p-E304-1~6] Research trend of laser processing technology incorporated with artificial intelligence

Wed. Mar 23, 2022 1:30 PM - 4:45 PM E304 (E304)

Daisuke Nakamura(Kyushu Univ.)

3:45 PM - 4:15 PM

[23p-E304-5] Prediction of electrical properties of poly-Si TFTs with artificial intelligence

〇Hiroshi Ikenoue1,2, Takayuki Kurashige1, Takahiro Nagano1, Keita Katayama1, Yoshiaki Kakimoto2, Daisuke Nakamura1, Tetsuya Goto3 (1.ISEE, Kyushu Univ., 2.Dept. of GPI, Kyushu Univ., 3.Tohoku Univ.)

Keywords:AI analysis, Laser Annealing, Semiconductor device

Artificial Intelligence (AI) analyses in semiconductor device fabrication are applied to complex processes with many control parameters. Thin film transistors (TFTs) can be formed on insulating films with low heat resistance such as interconnect layers of integrated circuits and glass substrates for display manufacturing. These manufacturing technologies have been developed along with the development of low temperature technologies by laser annealing. In this study, we focus on poly-Si TFTs and estimate the TFT electrical propertiess by deep learning of the optical microscope images of the poly-Si thin film surfaces after laser annealing.