The 69th JSAP Spring Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[24p-E103-1~17] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Thu. Mar 24, 2022 1:30 PM - 6:00 PM E103 (E103)

Yan Wu(Nihon Univ.), Katsunori Makihara(Nagoya Univ.)

5:00 PM - 5:15 PM

[24p-E103-14] Crystallization of a-Si Films deposited by RF Sputtering using Blue Direct Diode Laser (Part2)

〇Mitsuoki Hishida1, Kentaro Miyano1, Naohiko Kobata1, Masaki Nobuoka1, Takashi Noguchi2, Tatsuya Okada2 (1.Panasonic Smart Factory Solutions Co., Ltd., 2.Univ. of the Ryukyus)

Keywords:laser annealing, Blue laser, Polysilicon

This study has developed and tested a blue diode-laser light source that can achieve a beam parameter product (BPP) of less than 2mm mrad and features a high power density using a wavelength beam combining (WBC) technology while a blue laser stands out as a light source for a copper welding or cutting in terms of its high absorption rate.
It has been reported that a-Si film is successfully crystallized by a blue laser beam with the Si surface remained smooth after the beam irradiation. Furthermore, only changing a laser irradiation energy density allows for production of fine crystal grains which range from 10 nm to a few hundred nm in diameter, and which grow by more than a few micrometers in a laser beam irradiation direction.
In this experiment, a blue direct diode-laser beam developed using a WBC technology was stretched in a single axis to form a straight laser beam (100 μm×50 mm) which was used for irradiation onto a-Si film. This was designed for the purpose of realizing the mass production and a uniform surface.