[24p-E106-1~18] 3.7 Laser processing

[24p-E106-4] Dependence of Pulse Energy on Material Removal by Transient and Selective Laser Absorption in Synthetic Silica

〇(P)Reina Yoshizaki¹, Yusuke Ito¹, Guoqui Ren¹, Takumi Koike¹, Huijie Sun¹, Keisuke Nagato¹, Naohiko Sugita¹ (1.Univ. Tokyo)

Keywords:ultrashort pulse laser, glass, electron excitation

Transient and selective laser processing (TSL) is a highly efficient laser processing of glass, in which an electronically excited region generated by an ultrashort pulsed laser (USPL) selectively absorbs a low-intensity long-pulse laser of a wavelength that normally penetrates glass. In this study, the nonlinear Schrodinger equation for the optical propagation of USPL is solved by the split-step Fourier method, and the electronic excitation density is calculated in detail to discuss the pulse energy dependence of TSL processing in synthetic silica.