The 69th JSAP Spring Meeting 2022

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13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[25p-E307-1~15] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Fri. Mar 25, 2022 1:30 PM - 5:30 PM E307 (E307)

Takeshi Momose(Univ. of Tokyo), Osamu Sugiura(千葉工大)

2:15 PM - 2:30 PM

△ [25p-E307-4] Composition Effects on TDDB of Next Generation Interconnect Material CuAl2

〇Toshihiro Kuge1,2, Koike Junichi1 (1.Tohoku Univ., 2.JX Nippon Mining & Metals Corp.)

Keywords:semiconductor, interconnect material, intermetallic compound