Junya Wada

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Speaker, Author, Co-Author

Thu. Mar 16, 2023 1:00 PM - 6:45 PM A403 (Building No. 6)

Oral presentation
| 13 Semiconductors
| 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[16p-A403-1~20] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

6:15 PM - 6:30 PM

[16p-A403-19] Study of Highly Reliable Cu Dual-Damascene Interconnects using Ti Barrier for 3D Flash Memory

〇Junya Wada¹, Akira Nakajima¹, Yoshiki Aizawa¹, Masayuki Kitamura¹, Ryo Tanaka¹, Kotaro Fujii¹, Hisashi Kato¹, Masayoshi Tagami¹, Katsuyuki Sekine¹, Kazuya Ohuchi¹ (1.KIOXIA)

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