The 70th JSAP Spring Meeting 2023

Session information

Oral presentation

12 Organic Molecules and Bioelectronics » 12.7 Biomedical Engineering and Biochips

[18a-E102-1~11] 12.7 Biomedical Engineering and Biochips

Sat. Mar 18, 2023 9:00 AM - 12:00 PM E102 (Building No. 12)

Toshihiko Noda(Toyohashi Univ. of Tech.), Koichiro Miyamoto(Tohoku Univ.)

△:Presentation by Applicant for JSAP Young Scientists Presentation Award
▲:English Presentation
▼:Both of Above
No Mark:None of Above

11:45 AM - 12:00 PM

Yuta Aruga1, Kohei Nakamura1, Yaogan Liang1, Bang Du1, Shengwei Wang1, Bunta Inoue1, Hisashi Kino2, Takafumi Fukushima1, Koji Kiyoyama3, Tetsu Tanaka1,2 (1.Graduate School of Engineering, Tohoku Univ., 2.Graduate School of Biomedical Engineering, Tohoku Univ., 3.Dept. of Electrical and Electronics Engineering, Nagasaki Institute of Applied Science)

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