The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

3 Optics and Photonics » 3.14 Silicon photonics and integrated photonics (formerly 3.15)

[15p-A502-1~18] 3.14 Silicon photonics and integrated photonics (formerly 3.15)

Wed. Mar 15, 2023 1:10 PM - 6:00 PM A502 (Building No. 6)

Shota Kita(NTT), Tomohiro Kita(Waseda Univ.), Taichiro Fukui(Univ. of Tokyo)

5:45 PM - 6:00 PM

[15p-A502-18] Fabrication of waveguide isolators by μ-transfer printing of thin Ce:YIG/SGGG on Si waveguide

〇(DC)Daiki Minemura1, Rai Kou2, Yoshikatsu Sutoh2, Toshiya Murai2, Koji Yamada2, Yuya Shoji1 (1.Tokyo Tech., 2.AIST)

Keywords:transfer printing, magneto optical device, isolator

Wafer bonding is the main method for magneto optical devices. However, since a thick and large SGGG remains on Si circuits, it is difficult to achieve miniaturization and high-density integration. In this research, we make thin Ce:YIG/SGGG seals of several hundred µm and bonding on Si waveguide by µ-transfer printing. We propose waveguide optical isolators which enables high-density integration byµ-transfer printing.