The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

12 Organic Molecules and Bioelectronics » 12.2 Characterization and Materials Physics

[15p-B508-1~18] 12.2 Characterization and Materials Physics

Wed. Mar 15, 2023 1:00 PM - 6:00 PM B508 (Building No. 2)

Toyokazu Yamada(Chiba Univ.), Takayuki Miyamae(Chiba Univ.), Yuya Tanaka(Tokyo Tech)

1:45 PM - 2:00 PM

[15p-B508-4] Analysis of bending creep behavior of polymer films by real-time measurement of surface strain

〇(M1)Jiayi Yu1, Masayuki Kishino1, Kyohei Hisano1, Atsushi Shishido1 (1.Lab. for Chem. & Life Sci., Tokyo Tech)

Keywords:Polymer films, Bending, Strain

Polymer films are commonly used as substrates for flexible devices. The bending behavior of polymer films governs the performance of such devices under bending. Thus, it is important to elucidate the bending behavior of polymer films for the development of flexible devices. Owing to their viscoelasticity, polymers exhibit a creep phenomenon in which a temporal change of strain occurs while maintaining the bending state. In this study, the bending creep of various polymer films was investigated through real-time surface strain measurement. Moreover, a theoretical creep model was applied to the experimental results and analyzed the effect of viscoelasticity on the bending creep.