The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

21 Joint Session K "Wide bandgap oxide semiconductor materials and devices" » 21.1 Joint Session K "Wide bandgap oxide semiconductor materials and devices"

[15p-E102-1~17] 21.1 Joint Session K "Wide bandgap oxide semiconductor materials and devices"

Wed. Mar 15, 2023 1:30 PM - 6:15 PM E102 (Building No. 12)

Mamoru Furuta(Kochi Univ. of Tech.), Keisuke Ide(Tokyo Tech), Ken Goto(Tokyo Univ. Agri. and Tech.)

5:30 PM - 5:45 PM

[15p-E102-15] Killer Defects Responsible for Leakage Current in HVPE (001) β-Ga2O3 SBD Observed by Emission Microscopy and Synchrotron X-ray Topography

〇(D)Sayleap Sdoeung1, Kohei Sasaki2, Akito Kuramata2, Makoto Kasu1 (1.Saga Univ., 2.Novel Crystal Technology)

Keywords:Reverse leakage current, Killer defect, Schottky barrier diode

β-gallium oxide (β-Ga2O3) is a promising material for power device application owing to large bandgap (4.8 eV) and electric field (8 MV/cm). The availability of its high-quality substrate has accelerated the development of vertical β-Ga2O3- based power devices; for instance, Schottky barrier diodes (SBDs). However, killer defects degraded the performance of these devices. Therefore, we have identified the killer defect in halide vapor phase epitaxial (HVPE) (001) β-Ga2O3 SBDs that served as leakage path by mainly using ultra-high sensitive emission microscopy. As a result, we have found another type of killer defect contains (100) crack and dislocations along [100] direction below the surfaceserved as leakage current path of the HVPE (001) β-Ga2O3 SBDs.