The 70th JSAP Spring Meeting 2023

Presentation information

Poster presentation

8 Plasma Electronics » 8 Plasma Electronics (Poster)

[15p-PB03-1~15] 8 Plasma Electronics (Poster)

Wed. Mar 15, 2023 1:30 PM - 3:30 PM PB03 (Poster)

1:30 PM - 3:30 PM

[15p-PB03-8] Functionalization of hexagonal boron nitride via dangling bond formation using plasmas in solution

Kenichi Inoue1,2, Naoto Takagi1, Tsuyohito Ito1, Yoshiki Shimizu2, Kenji Ishikawa3, Masaru Hori3, Kazuo Terashima1,2 (1.The Univ. of Tokyo, 2.AIST, 3.Nagoya Univ.)

Keywords:Plasma in solution, Hexagonal boron nitride, Surface modification

Plasmas in solution provide reaction fields for surface modification processes, which are effective for hexagonal boron nitride (h-BN). About the reaction mechanism, it has been assumed that dangling bonds formed on h-BN by the plasma could be functionalized with hydroxyl groups by oxidization. In this study, the h-BN modified by plasmas in solution was moderately oxidized under atmospheric environment, and the hydroxyl functionalization via dangling bond formation was analyzed using electron spin resonance and Fourier transform infrared spectroscopy.