The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

CS Code-sharing session » 【CS.2】 Code-sharing Session of 3.4 & 3.13

[16p-A305-1~8] CS.2 Code-sharing Session of 3.4 & 3.13

Thu. Mar 16, 2023 1:00 PM - 3:00 PM A305 (Building No. 6)

Hiroshi Murata(Mie Univ.)

2:45 PM - 3:00 PM

[16p-A305-8] Temperature Dependent Lasing Characteristics of InGaAsP –MQW DFB Laser with pn-buried Heterostructure Grown on Semi-insulating InP Substrate

Hayato Arai1, Wataru Kobayashi1,2, Manabu Mitsuhara1, Takahiko Shindo1, Fumito Nakajima1 (1.NTT Device Technology Lab., 2.NTT Device Innovation Center)

Keywords:DFB laser, communication

Lasers on n-type InP substrates with semi-insulating(SI) buried-heterostructure(BH) are usually used for laser communication. On the other hand, lasers on SI substrates are easy to electrically isolate electrodes of lasers and modulators, which enables differential drive. However, lower thermal conductivity compared to n-type substrate leads to reduction in optical power. To solve this problem, we employed pn-BH structure. pn-BH structure can more effectively block current and dissipate heat. In this report, we fabricated pn-BH DFB laser on SI substrates and investigated temperature dependent characteristics.