2023年第70回応用物理学会春季学術講演会

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一般セッション(口頭講演)

22 合同セッションM 「フォノンエンジニアリング」 » 22.1 合同セッションM 「フォノンエンジニアリング」

[18a-D511-1~10] 22.1 合同セッションM 「フォノンエンジニアリング」

2023年3月18日(土) 09:00 〜 11:45 D511 (11号館)

竹内 恒博(豊田工大)、渡邉 孝信(早大)

10:00 〜 10:15

[18a-D511-5] Large-scale Integration of Cavity-free Micro Thermoelectric Device (4) Sensitivity for Heat Flux

〇(DC)Md MehdeeHasan Mahfuz1、Motohiro Tomita2、Takeo Matsuki3、Takanobu Watanabe1 (1.Waseda Univ.、2.Seikei Univ.、3.AIST)

キーワード:Thermoelectric generator, GeSn device, Seebeck effect

This work demonstrates a large-scale integrated thermoelectric (TE) device with a cavity-free architecture that can serve as a suitable heat flux sensor. Conventional heat flux sensors have difficulty to achieve both detection sensitivity and minimal impact on the measurement target. -free TE device could solve these problems, because its thermal resistance can be kept small and the sensitivity for the heat flux can be improved by miniaturization and large-scale integration. In this work, we investigated the heat flux sensitivity of our proposed device by Fabricating a large-scale integrated TE module.