[18p-D519-1~15] 6.5 Surface Physics, Vacuum

[18p-D519-15] Characterization of ultra-high vacuum vessel and welding using 0.2%Be-Cu material

〇Takao Nakamura¹, Masahide Kuroiwa², Shinsuke Kishikawa², Masanao Sasaki², Kazunari Okahashi², Keigo Sato³ (1.The Univ. of Tokyo, 2.Tokyo Electronics, 3.Furukawa Electric)

Keywords:Be-Cu, Vacuum vessel, Welding

0.2% Be-Cu (hereinafter referred to as BeCu) has excellent properties such as high thermal conductivity 13 times that of SUS, low heat radiation less than 1/7, and low outgassing, and is applied to vacuum components of ultra-high vacuum systems. . In recent years, the National Institute of Advanced Industrial Science and Technology has led the way in the practical use of a minimal fab system using 1/2" wafers as a semiconductor high-mix, low-volume production scheme. Minimal fab systems use small vacuum vessels. However, the ratio of the surface area of the wafer to the surface area of the vacuum chamber is larger than that of the large-scale equipment, and the surface quality of the vacuum chamber inevitably has a greater effect on the process. We have made a BeCu (O-ring seal) container equivalent to the vacuum container and compared its characteristics.This time, we fabricated and evaluated a gasket-sealed ultra-high vacuum container, and solved the problem that BeCu can only be processed by cutting. We investigated the application of welding using a hybrid laser.