Examination of curing using three-dimensional temperature stress analysis

Presentation information

第VI部門

Fri. Sep 16, 2022 1:00 PM - 2:20 PM VI-9 (吉田南総合館北棟　共北３４)

Chair: Masaki Taniguchi

1:40 PM - 1:50 PM

*Yuta Tatsumi¹ (1. Okumura Engineering Corporation)

Keywords:Three-dimensional temprature stress analysis, Thermal characteristics, Heat transfer coefficient

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