Special Interest Session » Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Wed. Nov 16, 2022 3:05 PM - 4:15 PM Room II (Clover Hall)

Chairperson:Koshi TAKENAKA(Nagoya University)

3:05 PM - 3:25 PM

[2-45] Invited Talk: Thermal stress control by using negative thermal expansion filler for higher performance three-dimensional integrated circuit

*Hisashi Kino¹ (1. Tohoku University)

3:25 PM - 3:45 PM

*Akihiro Takezawa¹ (1. Waseda University)

3:45 PM - 4:00 PM

*Ryoma Kasai¹, Masaya Sakaue¹, Haruna Satou¹, Kazunari Yasuda¹, Akihiro Takezawa¹ (1. Waseda University)

※This presenter is a candidate for the Student Award for Outstanding Presentation.

4:00 PM - 4:15 PM

*Masaya Sakagami¹, Ryoma Kasai¹, Haruna Sato¹, Akihiro Takezawa¹ (1. Waseda University)

※This presenter is a candidate for the Student Award for Outstanding Presentation.